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  • 產品詳細

    DENKA BG tape

    DENKA BG TAPE



      1)Very excellent lamination with wafer and easy de-lamination from wafer during backside grinding

      2)Completely free from fish-eye, gel, foreign material and so on which may cause damage to wafer

      3)As it is free from silicon , detergent and wax compositions in its adhesive, de-lamination of epoxy

      4)Protection of semiconductor circuits during the process of wafer backside grinding. 


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