
產(chǎn)品展示
- 半導(dǎo)體設(shè)備
- 半導(dǎo)體耗材
- 半導(dǎo)體零件
- 德國寶帝過程控制裝置
- 料盒
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- 三菱伺服驅(qū)動(dòng)系統(tǒng)
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聯(lián)系我們
- 139-1702-3872 何先生
- 上海市青浦區(qū)崧秋路229號
半導(dǎo)體耗材
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DENKA DC TAPE
DENKA DC TAPE
1) It has optimum adhesive strength enough to hold chip during
wafer sawing process
2) No contamination on the backside of chip due to deionized
water or silicon dust
3)Smooth pick-up can be possible after a period of long storage4)No tacky stain on the backside of chip after the pickup process5)Due to the above-mentioned characteristic, the dicing and pick-up worksof very thin wafer with 3mil 10mil thickness are possible with this tape