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  • 產(chǎn)品詳細(xì)

    DENKA DC TAPE

      DENKA DC TAPE


      1)  It has optimum adhesive strength enough to hold chip during

         wafer sawing process

      2)  No contamination on the backside of chip due to deionized

         water or silicon dust

      3)Smooth pick-up can be possible after a period of long storage
      4)No tacky stain on the backside of chip after the pickup process
      5)Due to the above-mentioned characteristic, the dicing and pick-up works

         of very thin wafer with 3mil 10mil thickness are possible with this tape


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